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Thermal - Heat Sinks
833900T00000 Picture

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833900T00000

  • Comair Rotron
  • New
  • HEATSINK STAMP 25.9X15X9.5MM
  • Datasheet download
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In Stock:19,146(Ref. price)
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Documents
Specifications
DescriptionDetails
Series
-
Package
Bulk
Type
Board Level
Package Cooled
TO-263 (D²Pak)
Attachment Method
SMD Pad
Shape
Rectangular, Fins
Length
0.590" (15.00mm)
Width
1.020" (25.91mm)
Diameter
-
Fin Height
0.375" (9.52mm)
Power Dissipation @ Temperature Rise
2.0W @ 40°C
Thermal Resistance @ Forced Air Flow
5.00°C/W @ 400 LFM
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
Tin
Other
Price advantage, 833900T00000 is available in stock and can be delivered on the same day
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